Device Package Including Molding Compound Having Non-Planar Top Surface Around A Die
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Meng-Tse Chen, Ming-Da Cheng, Chung-Shi Liu
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Abstract
A device package includes a die and a molding compound around the die. The molding compound has a non-planar surface recessed from a top surface of the die. The device package also includes an interconnect structure over the die. The interconnect structure includes a redistribution layer extending onto the molding compound and conformal to the non-planar surface of the molding compound. The device package further includes a first connector disposed over the die and bonded to the interconnect structure.
Claims20
A method comprising:
- attaching a first die and a second die to a carrier, each of the first die and the second die comprising:
- a substrate;
- a plurality of contact pads disposed over the substrate;
- and
- a passivation layer disposed over the plurality of contact pads;
- pressing a polymer layer over the first die and the second die, the pressing forming an air gap between the first die and the second die in a lateral direction, the air gap being between the carrier and the polymer layer in a vertical direction, the air gap having a first height in a center and a second height adjacent to the first die, the second height being greater than the first height;
- injecting a molding compound around edges of the first die and the second die and into the air gap;
- removing the polymer layer;
- and
- forming a redistribution structure over the first die and the second die.
A method comprising:
- pressing a polymer layer over a first die and a second die, each of the first die and the second die disposed over a carrier substrate;
- injecting a molding compound around the first die and the second die;
- removing the polymer layer;
- forming a redistribution structure over the first die and the second die, the redistribution structure comprising a first interconnect structure over the first die, the first interconnect structure comprising a first contact pad and a second contact pad, the first contact pad directly over the molding compound, the second contact pad directly over the first die;
- and
- forming a first connector over the first contact pad and a second connector over the second contact pad, a lowermost surface of the first connector being more proximal to the carrier substrate than a lowermost surface of the second connector.
A method comprising:
- attaching a first die to a carrier substrate, the first die comprising:
- a first bond pad;
- a second bond pad;
- and
- a first passivation layer disposed over the first bond pad and the second bond pad;
- attaching a second die to the carrier substrate;
- injecting a molding compound around the first die and the second die, a top of the first die and a top of the second die being free of the molding compound;
- and
- forming a redistribution structure over the first die and the second die, the redistribution structure comprising a first redistribution line extending from the first die to the second die, an entirety of a bottom surface of the first redistribution line physically contacting the molding compound.
Dependencies are inferred from the claim text.