Mounting head
AssigneeKabushiki Kaisha Shinkawa
InventorsManato NISHIDE, Kohei SEYAMA, Hijiri HAYASHI
Life of this patent
Estimating the term…
Abstract
A mounting apparatus is equipped with: an attachment including a surface for attaching a semiconductor die; a heater which is disposed on a side of the attachment opposite to the surface and heats the semiconductor die attached to the surface; a suction hole which penetrates through the attachment and the heater integrally and opens in the surface; and a body portion which is disposed on a side of the heater opposite to the attachment and on which a vacuum suction path in communication with the suction hole is arranged. The vacuum suction path includes a storage portion which stores a foreign matter consisting of a liquid formed by condensation of a gas suctioned from the suction hole or a solid formed by solidification of the liquid.
Claims13
A mounting head, which is used in an electronic component mounting apparatus that bonds electrodes of a semiconductor die and a substrate or electrodes of another semiconductor die,
- the mounting head comprising:
- an attachment, which has an attachment surface for attaching the semiconductor die;
- a bonding heater, which is disposed on a surface of the attachment opposite to the attachment surface and heats the attachment and the semiconductor die;
- a body portion, which holds the bonding heater on an end surface;
- a first opening portion, which is formed on the attachment surface of the attachment;
- a second opening portion, which is formed on a surface different from the end surface of the body portion;
- a suction path, which has a first bending portion for bending a flowing path of a gas suctioned from the first opening portion in the body portion and penetrates through the inside of the attachment, the bonding heater, and the body portion, and which discharges the gas suctioned from the first opening portion to the outside in the second opening portion;
- and
- a dripping prevention portion, which is formed in the suction path and inhibits droplets formed by condensation of the gas from dripping to the bonding heater.
Dependencies are inferred from the claim text.