Zinc-cobalt barrier for interface in solder bond applications
AssigneeTexas Instruments Incorporated
InventorsNazila Dadvand, Christopher Daniel Manack, Salvatore Frank Pavone
Life of this patent
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Abstract
A microelectronic device has bump bond structures on input/output (I/O) pads. The bump bond structures include copper-containing pillars, a barrier layer including cobalt and zinc on the copper-containing pillars, and tin-containing solder on the barrier layer. The barrier layer includes 0.1 weight percent to 50 weight percent cobalt and an amount of zinc equivalent to a layer of pure zinc 0.05 microns to 0.5 microns thick. A lead frame has a copper-containing member with a similar barrier layer in an area for a solder joint. Methods of forming the microelectronic device are disclosed.
Claims20
A microelectronic device, comprising:
- an input/output (I/O) pad;
- a bump bond structure electrically coupled to the I/O pad, the bump bond structure including:
- a copper-containing structure;
- a layer on at least a portion of the copper-containing structure, the layer including 0.1 weight percent to 50 weight percent cobalt, the layer including an amount of zinc equivalent to a layer of pure zinc 0.05 microns to 0.5 microns thick;
- and
- solder on the layer.
A microelectronic device, comprising:
- a portion of a lead frame including a copper structure, and a first layer on a first surface of the copper structure, the first layer including 0.1 weight percent to 50 weight percent cobalt, the first layer including an amount of zinc equivalent to a layer of pure zinc 0.05 microns to 0.5 microns thick;
- an electrically conductive member;
- and
- a solder joint connecting the copper structure to the electrically conductive member through the first layer.
A microelectronic device, comprising:
- a first copper structure;
- a first layer on the first copper structure, the first layer including 0.1 weight percent to 50 weight percent cobalt, the first layer including an amount of zinc equivalent to a layer of pure zinc 0.05 microns to 0.5 microns thick;
- and
- a solder joint on the first layer, the solder joint coupled to a second copper structure.
Dependencies are inferred from the claim text.