US 2020/0051938 A9 · FINGERPRINT CHIP PACKAGING METHOD AND FINGERPRINT CHIP PACKAGE

Abstract

A fingerprint chip packaging method and a fingerprint chip package are provided. During a process of packaging a fingerprint chip, the fingerprint chip is directly packaged and protected by a mold compound layer to form a thin package. With the fingerprint chip packaging method and the fingerprint chip package, the thickness of the package is greatly reduced, which facilitates miniaturization of the electronic device. Further, since the mold compound layer formed after curing of a mold compound material has a great mechanical strength, the mold compound layer can serve as a carrier substrate for mounting other electronic components of the electronic device, such that the integration of the electronic device is greatly improved, the space of the circuit board is saved, thereby facilitating the miniaturization of the electronic device.

Claims23

Dependent claims

A fingerprint chip packaging method, comprising:

providing a plurality of fingerprint chips arranged in an array on a carrier substrate, wherein each of the fingerprint chips has a front surface and a back surface opposite to each other, a sensing unit and a contact pad electrically connected to the sensing unit are provided on the front surface of the fingerprint chip, a solder bump electrically connected to the contact pad is provided on the back surface of the fingerprint chip, the solder bump faces upwards, and cutting trenches are arranged between adjacent ones of the fingerprint chips;
forming a mold compound layer covering the plurality of fingerprint chips;
grinding the mold compound layer to expose the solder bump to facilitate electrical connection between the solder bump and an external circuit;
and
dividing the mold compound layer along the cutting trenches to form a plurality of packages.

2 more elements

Dependencies are inferred from the claim text.

Fingerprint chip packaging method and fingerprint chip package

Life of this patent

Fingerprint chip packaging method and fingerprint chip package

Life of this patent

Abstract

Claims23