Contact Pad for Semiconductor Device

A device comprising:

• a die;
• a molding compound adjacent sidewalls of the die;
• a first redistribution structure over the die and the molding compound;
• a first contact pad on the first redistribution structure, the first contact pad being electrically coupled to the die by the first redistribution structure;
• and
• a first dummy feature adjacent the first contact pad, the first dummy feature having a first section and a second section, the first contact pad being interposed between the first section and the second section, the first dummy feature being electrically isolated from the die.

A device comprising:

• a die;
• a molding compound adjacent sidewalls of the die;
• a first redistribution structure over the die and the molding compound;
• a plurality of first contact pads over the first redistribution structure, each of the plurality of first contact pads being electrically coupled to the die by the first redistribution structure, a first subset of the plurality of first contact pads being in a non-dummy region, a second subset of the plurality of first contact pads being in a dummy region;
• and
• a plurality of first dummy features over the first redistribution structure, each of the plurality of first dummy features being adjacent to a corresponding one of the plurality of first contact pads in the second subset, each of the plurality of first dummy features being electrically isolated from the plurality of first contact pads, wherein at least one of the plurality of first dummy features being interposed between adjacent ones of the plurality of first contact pads in the second subset.