Method of manufacturing a redistribution layer, redistribution layer and integrated circuit including the redistribution layer

An integrated circuit, comprising:

• a redistribution layer that includes:
• an insulating layer;
• a conductive body extending on a top surface of the insulating layer;
• a first coating region extending around and above the conductive body, in contact with the conductive body and spaced apart from the top surface of the insulating layer;
• and
• a second coating region extending around and above the first coating region, and extending between the first coating region and the insulating layer, in contact with the first coating region and with the conductive body, completely sealing the first coating region from the insulating layer.

A method, comprising

• manufacturing a redistribution layer for an integrated circuit, the manufacturing including:
• forming an insulating layer having a bottom surface and a top surface, opposite to the bottom surface;
• forming a spacing layer on the top surface of the insulating layer;
• forming a conductive body above the spacing layer;
• forming a first coating region around and above the conductive body, in contact with the conductive body, and having a bottom surface in contact with the spacing layer;
• recessing the spacing layer to form a gap between the first coating region and the top surface of the insulating layer, completely exposing the bottom surface of the first coating region, said bottom surface being directly facing the top surface of the insulating layer, wherein the recessing leaves a portion of the spacing layer between a portion of the conductive body and the insulating layer;
• forming, after recessing the spacing layer, a second coating region extending around and above the first coating region, filling said gap and completely sealing the first coating region from the insulating layer.

An integrated circuit, comprising:

• a redistribution layer that includes:
• an insulating layer;
• spacers extending above a surface of the insulating layer;
• a conductive body extending above the spacers and in contact with the spacers, wherein the spacers are between a portion of the conductive body and the surface of the insulating layer;
• a first coating region extending around and above the conductive body, in contact with the conductive body, at a distance from the surface of the insulating layer;
• a second coating region extending around and above the first coating region and between the first coating region and the surface of the insulating layer, completely sealing the first coating region from the insulating layer and contacting the spacers.