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US 2020/0051933 A1Published application
Semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsYoo Rim CHA, Joo Hwan JUNG, Jung Chul GONG, Yong Ho BAEK, Young Sik HUR
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Abstract
A semiconductor package includes a connection member including an insulating layer and a redistribution layer, a semiconductor chip disposed on the connection member, and an inductance sensing part having a coil form and electrically connected to the semiconductor chip.
Claims20
A semiconductor package, comprising:
- a connection member including an insulating layer and a redistribution layer;
- a semiconductor chip disposed on the connection member;
- and
- an inductance sensing part having a coil form and electrically connected to the semiconductor chip.
1 more element
Dependencies are inferred from the claim text.