Semiconductor device and semiconductor package comprising the same

A semiconductor device having a semiconductor chip region and a scribe line region, and comprising:

• a substrate constituting a semiconductor chip, the semiconductor chip disposed in the semiconductor chip region and having semiconductor chip wiring, and the substrate extending into the scribe line region;
• a first insulating film disposed in the semiconductor chip region and the scribe line region;
• a first wiring in the scribe line region at an upper portion of the first insulating film;
• a second insulating film disposed on the first insulating film, the second insulating film having a first region delimiting a first opening exposing the substrate, and a second region delimiting a second opening exposing the first wiring;
• and
• a passivation film disposed on the second insulating film,
• wherein the passivation film exposes both the first region of the second insulating film and the second region of the second insulating film, and
• a width of the first region of the second insulating film being less than a width of the second region of the second insulating film.