Semiconductor package

A semiconductor package comprising:

• a support frame having a first surface and a second surface opposing each other, and including a cavity connecting the first and second surfaces;
• a semiconductor chip disposed in the cavity, and having an active surface on which contact pads are arranged;
• a connection member disposed on the second surface of the support frame and on the active surface of the semiconductor chip;
• and
• an encapsulant encapsulating the semiconductor chip disposed in the cavity,
• wherein the semiconductor chip includes:
• a first insulating film disposed on the active surface and exposing the contact pads, a second insulating film disposed on the first insulating film and including a first opening exposing connection regions of the contact pads, and a conductive crack preventing layer disposed on the connection regions and extending to a portion of the second insulating film around the first opening, and
• wherein the connection member includes:
• an insulating layer disposed on the second surface of the support frame and on the active surface of the semiconductor chip, and including a second opening exposing the connection regions, the second opening being greater than the first opening;
• and a redistribution layer connected to the connection regions through the second opening.