EMI Shielding for Flip Chip Package with Exposed Die Backside

A semiconductor device, comprising:

• a semiconductor die;
• an encapsulant deposited over the semiconductor die;
• and
• a first shielding layer formed on the semiconductor die, wherein the first shielding layer includes a plurality of layers.

A method of making a semiconductor device, comprising:

• providing a semiconductor die;
• depositing an encapsulant over the semiconductor die, wherein a surface of the semiconductor die is exposed from the encapsulant;
• and
• forming a shielding layer over the surface of the semiconductor die, wherein the shielding layer includes a plurality of layers.

A method of making a semiconductor device, comprising:

• providing a semiconductor die;
• depositing an encapsulant over the semiconductor die;
• and
• forming a first shielding layer over the surface of the semiconductor die after depositing the encapsulant, wherein the first shielding layer includes a plurality of layers.