Semiconductor device with an em-integrated damper

A semiconductor device, comprising:

• a shielding case;
• a conductive structure, coupled to the shielding case;
• a printed circuit board, disposed below the shielding case and coupled to a ground;
• and
• a passive electronic component,
• wherein the shielding case is placed on the printed circuit board,
• wherein the conductive structure is installed vertically between an inner surface of a top portion of the shielding case and the printed circuit board, and is coupled to a first pad of the printed circuit board,
• wherein the passive electronic component comprises a first terminal coupled to the first pad of the printed circuit board and a second terminal coupled to a second pad of the printed circuit board, and
• wherein the conductive structure and the passive electronic component are connected in series between the top portion of the shielding case and the ground to form a conductive path for conducting at least one electromagnetic interference (EMI) signal generated inside of the shielding case to the ground.

A semiconductor device, comprising:

• a first package assembly, comprising:
• an interposer substrate;
• a second package assembly, disposed below the first package assembly and comprising:
• a package substrate, coupled to a ground;
• a conductive structure, coupled to the interposer substrate;
• and
• a passive electronic component, coupled to the package substrate,
• wherein the conductive structure is installed vertically between the interposer substrate and the package substrate, and the conductive structure is coupled to a first pad of the package substrate,
• wherein the passive electronic component comprises a first terminal coupled to the first pad of the package substrate and a second terminal coupled to a second pad of the package substrate, and
• wherein the conductive structure and the passive electronic component are connected in series between the interposer substrate and the ground to form a conductive path for conducting at least one electromagnetic interference (EMI) signal to the ground.