Semiconductor device
AssigneeToshiba Memory Corporation
InventorAtsushi KATAOKA
Life of this patent
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Abstract
A semiconductor device includes a substrate having a first surface, a second surface opposite to the first surface, and a side surface extending between the first surface and the second surface; a pad electrode provided on the first surface of the substrate; an internal wiring provided in the substrate, and electrically connected to the pad electrode; a first wiring provided in the substrate, and exposed from the substrate at the side surface; an insulator provided between the first wiring and the internal wiring so as to separate the first wiring from the internal wiring; a semiconductor chip provided on the substrate, and electrically connected to the pad electrode; and a resin covering the semiconductor chip.
Claims17
A semiconductor device, comprising:
- a substrate having a first surface, a second surface opposite to the first surface, and a side surface extending between the first surface and the second surface;
- a pad electrode provided on the first surface of the substrate;
- an internal wiring provided in the substrate, and electrically connected to the pad electrode;
- a first wiring provided in the substrate, and exposed from the substrate at the side surface;
- an insulator provided between the first wiring and the internal wiring so as to separate the first wiring from the internal wiring;
- a semiconductor chip provided on the substrate, and electrically connected to the pad electrode;
- and
- a resin covering the semiconductor chip.
A semiconductor device, comprising:
- a substrate having a first surface, a second surface opposite to the first surface, and a side surface extending between the first surface and the second surface;
- a pad electrode provided on the first surface of the substrate;
- an internal wiring provided in the substrate, and electrically connected to the pad electrode;
- a first wiring provided in the substrate, and exposed from the substrate at the side surface;
- an insulator provided between the first wiring and the internal wiring so as to separate the first wiring from the internal wiring;
- a semiconductor chip provided on the substrate, and electrically connected to the pad electrode;
- and
- a resin covering the semiconductor chip,
- wherein the first wiring is provided closer to the second surface than the first surface, and
- the substrate includes a first recess portion between the first wiring and the internal wiring.
Dependencies are inferred from the claim text.