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US 2020/0051916 A1Published application
Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling same
AssigneeIntel Corporation
InventorsAndrew COLLINS, Debendra MALLIK, Mathew J. MANUSHAROW, Jianyong XIE
Life of this patent
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Abstract
An embedded multi-die interconnect bridge (EMIB) die is configured with power delivery to the center of the EMIB die and the power is distributed to two dice that are interconnected across the EMIB die.
Claims21
(canceled)
A bridge die, comprising:
- a first outer portion, a second outer portion, and a central portion from a plan view perspective, the central portion between the first outer portion and the second outer portion;
- a plurality of power-delivery micro-vias in the central portion;
- a first plurality of power-distribution micro-vias in the first outer portion, the first plurality of power-distribution micro-vias electrically coupled to the plurality of power-distribution micro-vias;
- and
- a second plurality of power-distribution micro-vias in the second outer portion, the second plurality of power-distribution micro-vias electrically coupled to the plurality of power-delivery micro-vias, and the second plurality of power-distribution micro-vias having a total number of power-distribution micro-vias less than a total number of power-distribution micro-vias of the first plurality of power-distribution micro-vias.
2 more elements
An embedded multi-die interconnect bridge package, comprising:
- a packaging material comprising a plurality of build-up layers;
- a bridge die embedded in the packaging material, the bridge die comprising:
- a first outer portion, a second outer portion, and a central portion from a plan view perspective, the central portion between the first outer portion and the second outer portion;
- a plurality of power-delivery micro-vias in the central portion;
- a first plurality of power-distribution micro-vias in the first outer portion, the first plurality of power-distribution micro-vias electrically coupled to the plurality of power-distribution micro-vias;
- and
- a second plurality of power-distribution micro-vias in the second outer portion, the second plurality of power-distribution micro-vias electrically coupled to the plurality of power-delivery micro-vias, and the second plurality of power-distribution micro-vias having a total number of power-distribution micro-vias less than a total number of power-distribution micro-vias of the first plurality of power-distribution micro-vias;
- and
- a first semiconductive device on the packaging material, the first semiconductive device electrically coupled to the first outer portion of the bridge die;
- and
- a second semiconductive device on the packaging material, the second semiconductive device electrically coupled to the second outer portion of the bridge die.
8 more elements
Dependencies are inferred from the claim text.