Die Interconnect Substrate, an Electrical Device, and a Method for Forming a Die Interconnect Substrate

An electrical device, comprising:

• a die interconnect substrate comprising a bridge die comprising at least one bridge interconnect connecting a first bridge die pad of the bridge die to a second bridge die pad of the bridge die;
• a first semiconductor device connected to the first bridge die pad;
• and
• a second semiconductor device connected to the second bridge die pad,
• wherein the die interconnect substrate further comprises a multilayer substrate structure comprising a substrate interconnect, wherein the bridge die is embedded in the multilayer substrate structure,
• wherein the die interconnect substrate further comprises a via portion formed on the first bridge die pad of the bridge die, and
• wherein an average angle between a surface of the first bridge die pad and a sidewall of the via portion lies between 85° and 95°.

A method for forming a die interconnect substrate, the method comprising:

• placing a bridge die in a cavity of a multilayer substrate structure, wherein the bridge die comprises at least one bridge interconnect connecting a first bridge die pad of the bridge die to a second bridge die pad of the bridge die;
• forming a mask layer on the bridge die;
• removing portions of the mask layer to form openings exposing at least part of the first bridge die pad and the second bridge die pad by a lithographic process;
• and
• forming electrically conductive material in the openings of the mask layer to form a via portion on the first bridge die pad.