Circuit device provided with circuit board and circuit component, and method for manufacturing said circuit device

A circuit device comprising:

• a circuit board having a front side provided with a conductive pattern;
• a conductive plate laminated on a back side of the circuit board via an insulating layer;
• and
• a circuit component that is placed on the conductive plate through an open hole passing through the circuit board from the front side of the circuit board to the back side, and that is provided with a first terminal and a second terminal,
• wherein the circuit device comprises a conductive path that is formed on the insulating layer using a conductive adhesive, and a portion of the conductive path is interposed between the insulating layer and the back side of the circuit board,
• the first terminal is electrically connected to the conductive path,
• the second terminal is electrically connected to the conductive plate through a missing portion formed in the insulating layer, the conductive pattern extends to the back side of the circuit board, and
• the conductive path interposed between the insulating layer and the circuit board and the conductive pattern extending to the back side of the circuit board are adhered to each other where the respective surfaces overlap each other, and are electrically connected to each other, and a layer structure is formed in the order of the insulating layer, the conductive path, and the conductive pattern.