High density embedded interconnects in substrate
AssigneeQUALCOMM Incorporated
InventorsKuiwon KANG, Marcus HSU, Brigham NAVAJA, Houssam JOMAA
Life of this patent
Estimating the term…
Abstract
A device that includes a die and a substrate coupled to the die. The substrate includes a dielectric layer and a plurality of embedded interconnects. Each embedded interconnect located through a first planar surface of the substrate such that a first portion of the embedded interconnect is located within the dielectric layer and a second portion of the embedded interconnect is external of the dielectric layer. In some implementations, the substrate includes a core layer. In some implementations, the dielectric layer and the plurality of embedded interconnects may be part of a build up layer of the substrate.
Claims27
A device comprising:
- a die;
- and
- a substrate coupled to the die, the substrate including:
- a dielectric layer;
- and
- a plurality of embedded interconnects, each embedded interconnect located through a first planar surface of the substrate such that a first portion of the embedded interconnect is located within the dielectric layer and a second portion of the embedded interconnect is external of the dielectric layer.
A substrate comprising:
- a dielectric layer;
- and
- a plurality of embedded interconnects, each embedded interconnect located through a first planar surface of the substrate such that a first portion of the embedded interconnect is located within the dielectric layer and a second portion of the embedded interconnect is external of the dielectric layer.
A method for fabricating a substrate, comprising:
- forming a dielectric layer;
- and
- forming a plurality of embedded interconnects in the dielectric layer, wherein each embedded interconnect is formed through a first planar surface of the substrate such that a first portion of the embedded interconnect is located within the dielectric layer and a second portion of the embedded interconnect is external of the dielectric layer.
Dependencies are inferred from the claim text.