Package structure and manufacturing method thereof
AssigneeInnolux Corporation
InventorsHsueh-Hsuan Chou, Chia-Chieh Fan, Cheng-Chi Wang, Kuan-Jen Wang
Life of this patent
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Abstract
A package structure includes a redistribution layer having a first surface, a second surface disposed opposite to the first surface, and at least one sidewall connected to the first surface and the second surface, at least one bonding electrode disposed on the first surface of the redistribution layer, and a mounting layer disposed on the second surface of the redistribution layer. The mounting layer includes a plurality of conductive pads that are spaced apart from each other. At least one of the conductive pads is exposed by the sidewall of the redistribution layer.
Claims14
A package structure, comprising:
- a redistribution layer, wherein the redistribution layer comprises a first surface, a second surface disposed opposite to the first surface, and at least one sidewall connected to the first surface and the second surface;
- at least one bonding electrode disposed on the first surface of the redistribution layer;
- and
- a mounting layer disposed on the second surface of the redistribution layer, the mounting layer comprising a plurality of conductive pads that are spaced apart from each other,
- wherein at least one of the conductive pads is exposed by the sidewall of the redistribution layer.
A method of manufacturing a package structure, comprising:
- providing a substrate, wherein a width of the substrate in any direction is greater than or equal to 400 mm;
- forming a release layer on the substrate;
- forming amounting layer on the release layer, wherein the mounting layer is a patterned layer and comprises a plurality of conductive pads spaced apart from each other;
- forming a redistribution layer on the release layer and the conductive pads, wherein the redistribution layer has a first surface at a side of the redistribution layer opposite to the release layer, and the redistribution layer includes at least one bonding electrode disposed at the first surface;
- bonding at least one electronic device on the first surface of the redistribution layer, the electronic device being electrically connected to the bonding electrode;
- forming a molding layer on the first surface of the redistribution layer;
- performing a separation process to separate the release layer and the substrate from the redistribution layer and the mounting layer;
- and
- forming a solder ball on one of the conductive pads.
Dependencies are inferred from the claim text.