Leadframe, Semiconductor Package and Method

A semiconductor package, comprising:

• a first semiconductor device;
• and
• a leadframe comprising:
• a first electrically conductive part and a second electrically conductive part, each having an outer surface arranged to provide substantially coplanar outer contact areas having a footprint and an inner surface opposing the outer surface, the first electrically conductive part being spaced apart from the second electrically conductive part by a gap;
• a first recess arranged in the inner surface of the first electrically conductive part;
• a second recess arranged in the inner surface of the second electrically conductive part;
• and
• a first electrically conductive insert arranged in, and extending between, the first recess and the second recess and bridging the gap between the first electrically conductive part and the second electrically conductive part;
• and
• wherein the first electrically conductive insert forms a portion of an internal electrically conductive redistribution structure between the first semiconductor device and an outer contact area of the leadframe.

A method of fabricating a semiconductor package, the method comprising:

• providing an electrically conductive leadframe comprising a first part and a second part, each having an outer surface providing an outer contact area and an inner surface opposing the outer surface, the first part being spaced apart from the second part by a gap, a first recess arranged in the inner surface of the first part and a second recess arranged in the inner surface of the second part;
• inserting an electrically conductive insert into the first recess and the second recess such that the electrically conductive insert extends from the first recess to the second recess and bridges the gap between the first part and the second part;
• mechanically attaching the electrically conductive insert to the first recess and the second recess;
• and
• mounting a first semiconductor device onto the first part of the leadframe.