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US 2020/0051894 A1Published application
Thermal assemblies for multi-chip packages
AssigneeIntel Corporation
InventorsZhimin Wan, Je-Young Chang, Chia-Pin Chiu, Shankar Devasenathipathy, Betsegaw Kebede Gebrehiwot, Chandra Mohan Jha
Life of this patent
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Abstract
Disclosed herein are thermal assemblies for multi-chip packages (MCPs), as well as related methods and devices. For example, in some embodiments, a thermal assembly for an MCP may include a heat pipe having a ring shape.
Claims25
An apparatus, comprising:
- a thermal assembly for a multi-chip package (MCP), including:
- a heat pipe having a ring shape.
An apparatus, comprising:
- a thermal assembly for a multi-chip package (MCP), including:
- a plurality of heat pipes arranged in a ring shape such that individual heat pipes extend from an opening in the ring shape to an exterior of the ring shape.
An apparatus, comprising:
- a package substrate having a first surface and an opposing second surface;
- a plurality of integrated circuit (IC) components coupled to the package substrate such that the second surface is between the first surface and the plurality of IC components, wherein the plurality of IC components include at least one inner IC component and a plurality of outer IC components;
- and
- a heat channel, wherein a first portion of the heat channel is embedded in the package substrate at least partially under one of the outer IC components and a second portion extends from the second surface of the package substrate.
1 more element
An apparatus, comprising:
- a package substrate;
- and
- a plurality of integrated circuit (IC) components coupled to the package substrate, wherein the plurality of IC components include at least one inner IC component and a plurality of outer IC components, and wherein at least some of the plurality of outer IC components are coupled to the package substrate via intervening interposers.
Dependencies are inferred from the claim text.