Power semiconductor module and vehicle

A power semiconductor module comprising a cooling apparatus and a power semiconductor device mounted on the cooling apparatus, wherein

• the cooling apparatus includes:
• a ceiling plate that has a bottom surface;
• a case that has a coolant flow-through portion and an outer edge portion surrounding the coolant flow-through portion, with the coolant flow-through portion being arranged on the bottom surface side of the ceiling plate in firm contact, either directly or indirectly, with the bottom surface of the ceiling plate at the outer edge portion;
• and
• a cooling fin that is arranged in the coolant flow-through portion,
• the ceiling plate and the case respectively include fastening portions that are used to fasten the ceiling plate and the case to an external apparatus, while the ceiling plate and the outer edge portion are arranged in an overlapping manner,
• the power semiconductor device includes a circuit substrate and a terminal case,
• the fastening portions protrude farther outward than a periphery of the ceiling plate, and
• the terminal case includes a case body arranged along a perimeter of the circuit substrate and reinforcing portions that extend to top surface sides of the fastening portions.