Devices For Absorbing Energy From Electronic Components
AssigneeLaird Technologies, Inc.
InventorsJason L. STRADER, Eugene Anthony PRUSS
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Abstract
A device for absorbing energy from an electronic component includes a low melting alloy layer including a first side and a second side opposing the first side, and coating layers substantially covering the first side and the second side of the low melting alloy layer. In some embodiments, the low melting alloy layer includes a polymer mixture and a plurality of low melting alloy particulates dispersed in the polymer mixture. Other example devices are also disclosed.
Claims20
A method relating to reduction of transient temperature spikes in an electronic component, the method comprising positioning a low melting alloy relative to the electronic component for absorbing energy from transient temperature spikes in the electronic component whereby the absorbed energy facilitates a phase transition of the low melting alloy and thereby reduces the transient temperature spikes in the electronic component.
A device for absorbing energy from transient temperature spikes in an electronic component, the device comprising a low melting alloy configured to be positionable relative to the electronic component for absorbing energy from transient temperature spikes in the electronic component whereby the absorbed energy facilitates a phase transition of the low melting alloy and thereby reduces the transient temperature spikes in the electronic component.
A board level shield comprising a fence configured to be coupled to a substrate generally around an electronic component on the substrate, and a lid configured to be coupled to the fence whereby the board level shield is operable for providing shielding of the electronic component, wherein the lid comprises a low melting alloy positionable relative to the electronic component for absorbing energy from transient temperature spikes in the electronic component whereby the absorbed energy facilitates a phase transition of the low melting alloy and thereby reduces the transient temperature spikes in the electronic component.
Dependencies are inferred from the claim text.