Apparatuses and methods for implementing a sliding thermal interface between substrates with varying coefficients of thermal expansion
AssigneeCerebras Systems Inc.
InventorJean-Philippe Fricker
Life of this patent
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Abstract
Systems and methods include an integrated circuit assembly that includes a semiconductor substrate; a heat transfer element; and an ambulatory thermal interface arranged between the semiconductor substrate and the heat transfer element, the ambulatory thermal interface comprising: a thermally conductive material, and a friction reduction material, wherein: the thermally conductive material is arranged along a surface of the heat transfer element, the friction reduction material is arranged along a surface of the semiconductor substrate, opposing surfaces of the thermally conductive material and the friction reduction material define a slidable interface when placed in contact.
Claims20
An integrated circuit assembly comprising:
- a semiconductor substrate;
- a heat transfer element;
- and
- an ambulatory thermal interface arranged between the semiconductor substrate and the heat transfer element, the ambulatory thermal interface comprising:
- (i) a thermally conductive material, and
- (ii) a friction reduction material,
- wherein:
- (a) the thermally conductive material is arranged along a surface of the heat transfer element,
- (b) the friction reduction material is arranged along a surface of the semiconductor substrate,
- (c) opposing surfaces of the thermally conductive material and the friction reduction material define a slidable interface when placed in contact.
An integrated circuit assembly comprising:
- a semiconductor substrate;
- a heat transfer element;
- and
- an ambulatory thermal interface arranged between the semiconductor substrate and the heat transfer element, the ambulatory thermal interface comprising:
- (i) a thermally conductive material, and
- (ii) a friction reduction material,
- wherein:
- (a) the thermally conductive material is arranged along a surface of the semiconductor substrate,
- (b) the friction reduction material is arranged along a surface of the heat transfer element,
- (c) opposing surfaces of the thermally conductive material and the friction reduction material define a slidable interface when placed in contact.
An integrated circuit assembly comprising:
- a heat source;
- a heat dissipater;
- a sliding thermal interface interposed between the heat source and the heat dissipater, the sliding thermal interface comprising:
- (i) a thermally conductive material is arranged along a surface of the heat dissipater;
- (ii) a friction reduction material is arranged along a surface of the heat source;
- (iii) opposing surfaces of the thermally conductive material and the friction reduction material define a slippery interface that enables a relative movement between the thermal conductive material and the friction reduction material when in contact.
An integrated circuit assembly comprising:
- a semiconductor substrate;
- a heat transfer element;
- and
- an ambulatory thermal interface arranged between the semiconductor substrate and the heat transfer element, the ambulatory thermal interface comprising:
- (i) a friction reduction material,
- wherein:
- (a) a first surface of the friction reduction material opposes a surface of the heat transfer element,
- (b) a second surface of the friction reduction material is arranged along a surface of the semiconductor substrate, and
- (c) the first surface of the friction reduction material and the surface of the heat transfer element define a slidable interface when placed in contact.
Dependencies are inferred from the claim text.