Semiconductor device, printed circuit board, electronic device, and image pickup apparatus

Abstract

A semiconductor device includes a rigid substrate, a plate-like heat dissipating member, and a semiconductor element provided between the rigid substrate and the heat dissipating member and mounted on the rigid substrate. The heat dissipating member includes a first portion that defines a slit or a recess portion. The first portion extends along a first virtual line segment extending from a first side of an outer periphery of a first region that overlaps with the semiconductor element toward an outside of the first region as viewed in a direction perpendicular to a main surface of the heat dissipating member, and a length of the first portion in a direction parallel to the first side is equal to or smaller than a length of the first portion in a direction perpendicular to the first side.

Dependencies are inferred from the claim text.