US 2020/0051884 A1 · STRUCTURES TO FACILITATE HEAT TRANSFER WITHIN PACKAGE LAYERS TO THERMAL HEAT SINK AND MOTHERBOARD

Abstract

Embodiments disclosed herein include electronics packages with improved thermal pathways. In an embodiment, an electronics package includes a package substrate. In an embodiment, the package substrate comprises a plurality of backside layers, a plurality of front-side layers, and a core layer between the plurality of backside layers and the plurality of front-side layers. In an embodiment, an inductor is embedded in the plurality of backside layers. In an embodiment, a plurality of bumps are formed over the front-side layers and thermally coupled to the inductor. In an embodiment, the plurality of bumps are thermally coupled to the core layer by a plurality of vias.

Claims25

Dependent claims

An electronics package, comprising:

a package substrate, wherein the package substrate comprises:
a plurality of backside layers;
a plurality of front-side layers;
and
a core layer between the plurality of backside layers and the plurality of front-side layers;
an inductor embedded in the plurality of backside layers;
and
a plurality of bumps over the front-side layers and thermally coupled to the inductor, wherein the plurality of bumps are thermally coupled to the core layer by a plurality of vias.

5 more elements

Dependencies are inferred from the claim text.

Structures to facilitate heat transfer within package layers to thermal heat sink and motherboard

Life of this patent

Structures to facilitate heat transfer within package layers to thermal heat sink and motherboard

Life of this patent

Abstract

Claims25