Shielded fan-out packaged semiconductor device and method of manufacturing

A method of packaging a semiconductor device, comprising:

• electrically coupling a semiconductor die to die contacts at a first side of a redistribution structure, wherein the die contacts are electrically coupled to ball pads at a second side of the redistribution structure;
• forming a contiguous conductive wall around the semiconductor die by depositing a conductive material onto the redistribution structure such that the conductive wall is formed progressively with increasing height, wherein the conductive wall is electrically coupled to at least one shield contact at the first side of the redistribution structure, and wherein the shield contact is electrically coupled to a ball pad at the second side of the redistribution structure;
• depositing an encapsulant over the semiconductor die and the conductive wall, wherein the encapsulant is deposited after forming the conductive wall and has an upper surface;
• removing a portion of the encapsulant and a portion of the conductive wall to form the upper surface on the encapsulant over the semiconductor die and a top surface on the conductive wall, wherein the upper surface of the encapsulant and the top surface of the conductive wall are coplanar;
• and
• disposing a conductive cap onto the upper surface of the encapsulant, wherein the conductive cap is electrically coupled to the conductive wall.