Semiconductor device comprising a recess and method of fabricating the same
AssigneeInfineon Technologies AG
InventorsThomas Bemmerl, Michael Stadler
Life of this patent
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Abstract
A semiconductor device is disclosed. In one example, the semiconductor device comprises a die carrier comprising an X-shaped recess on a first surface of the die carrier; a semiconductor die arranged over the first surface of the die carrier and at least partly covering the X-shaped recess; and a coupling agent attaching the semiconductor die to the die carrier, wherein the coupling agent is at least partially arranged in the X-shaped recess. Each of the four arms of the X-shaped recess points towards a corner of the semiconductor die and extends over an outline of the semiconductor die in an orthogonal projection onto the first surface of the die carrier.
Claims20
A semiconductor device, comprising:
- a die carrier comprising an X-shaped recess on a first surface of the die carrier;
- a semiconductor die arranged over the first surface of the die carrier and at least partly covering the X-shaped recess;
- and
- a coupling agent attaching the semiconductor die to the die carrier, wherein the coupling agent is at least partially arranged in the X-shaped recess,
- wherein each of the four arms of the X-shaped recess points towards a corner of the semiconductor die and extends over an outline of the semiconductor die in an orthogonal projection onto the first surface of the die carrier.
A semiconductor device, comprising:
- a die carrier comprising an X-shaped recess on a first surface of the die carrier;
- a semiconductor die arranged over the first surface of the die carrier and at least partly covering the X-shaped recess;
- and
- a coupling agent attaching the semiconductor die to the die carrier,
- wherein each of the four arms of the X-shaped recess points towards a corner of the semiconductor die, and
- wherein a main portion of each arm of the X-shaped recess is formed by straight sides of the respective arm.
A method for fabricating a semiconductor device, the method comprising:
- providing a die carrier comprising an X-shaped recess on a first surface of the die carrier;
- depositing a coupling agent over a center of the X-shaped recess;
- and
- attaching a semiconductor die to the deposited coupling agent, wherein each of the four arms of the X-shaped recess points towards a corner of the semiconductor die and extends over an outline of the semiconductor die in an orthogonal projection onto the first surface of the die carrier.
Dependencies are inferred from the claim text.