Printed circuit board and semiconductor package including the same
AssigneeSamsung Electronics Co., Ltd.
InventorKeun-ho Jang
Life of this patent
Estimating the term…
Abstract
A semiconductor package including a package substrate including a mounting region and at least one through-hole arranged in the mounting region, and a semiconductor chip mounted on the mounting region, the semiconductor chip including a first side and a second side, the second side of the semiconductor chip being opposite to the first side of the semiconductor chip, the at least one through-hole of the package substrate being closer to the second side of the semiconductor chip than the first side of the semiconductor chip may be provided.
Claims20
A semiconductor package comprising:
- a package substrate including a mounting region and at least one through-hole arranged in the mounting region;
- and
- a semiconductor chip mounted on the mounting region, the semiconductor chip including a first side and a second side, the second side of the semiconductor chip being opposite to the first side of the semiconductor chip, the second side of the semiconductor chip being closer to the at least one through-hole of the package substrate than the first side of the semiconductor chip.
A semiconductor package comprising:
- a package substrate;
- a semiconductor chip mounted on the package substrate, the semiconductor chip including a first side and a second side opposite to the first side;
- and
- a molding layer including an underfill part between the semiconductor chip and a first surface of the package substrate, and at least one extension part penetrating the package substrate, the extension part being between the first side of the semiconductor chip and the second side of the semiconductor chip, the extension part being closer to the second side of the semiconductor chip than the first side of the semiconductor chip.
A printed circuit board for a molded underfill process in which a mold material is injected in one direction, the printed circuit board comprising:
- a substrate base including a first side and a second side opposite to the first side, the first side of the substrate base being a side into which a mold material is injected;
- and
- at least one through-hole penetrating the substrate base, the at least one through-hole configured to receive the mold material therethrough, the at least one through-hole being closer to the second side of the substrate base than to the first side of the substrate base.
Dependencies are inferred from the claim text.