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US 2020/0051877 A1Published application
Substrate processing carrier
AssigneeSemiconductor Components Industries, LLC
InventorMichael J. SEDDON
Life of this patent
Estimating the term…
Abstract
Implementations of a substrate carrier may include: a top ring configured to enclose an edge of a first side of a substrate; and a bottom support configured to enclose an entire second side and an edge of the second side of the substrate.
Claims20
A substrate carrier comprising:
- a top ring configured to enclose an edge of a first side of a substrate;
- and
- a bottom support configured to enclose an entire second side and an edge of the second side of the substrate.
A substrate carrier comprising:
- a top ring configured to enclose an edge of a first side of a substrate;
- and
- a bottom support configured to enclose an entire second side and an edge of the second side of the substrate, wherein the bottom support further comprises a cavity therein configured to receive backgrinding tape applied to the second side of the substrate.
An apparatus for testing a semiconductor substrate, comprising:
- a substrate carrier, the substrate carrier comprising:
- a top ring configured to enclose an edge of a first side of a substrate;
- and
- a bottom support configured to enclose an entire second side and an edge of the second side of the substrate, wherein the bottom support is configured to allow a semiconductor substrate coupled with the substrate carrier to be electrically tested using a probe.
1 more element
Dependencies are inferred from the claim text.