System and method for a transducer in an ewlb package
AssigneeInfineon Technologies AG
InventorsStephan Pindl, Daniel Lugauer, Dominic Maier, Alfons Dehe
Life of this patent
Estimating the term…
Abstract
According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.
Claims20
A method of forming a sensor package, the method comprising:
- forming an ambient sensor on a first surface of a dummy patterning structure;
- arranging the dummy patterning structure on a carrier substrate;
- arranging an integrated circuit die on the carrier substrate;
- embedding the dummy patterning structure and the integrated circuit die in electrically insulating material;
- removing the carrier substrate;
- exposing a second surface of the dummy patterning structure by thinning the electrically insulating material, the second surface opposite the first surface;
- and
- forming a cavity in the electrically insulating material by etching the dummy patterning structure.
A method of forming a sensor package, the method comprising:
- forming an ambient sensor comprising a top surface and a bottom surface, the top surface being opposite the bottom surface, wherein the ambient sensor has a planar structure, and the entire top surface of the ambient sensor is parallel to the entire bottom surface of the ambient sensor;
- forming embedding material adjacent to the ambient sensor, wherein the top surface of the ambient sensor and the embedding material form a boundary of a first cavity and the top surface of the ambient sensor faces an unfilled void of the first cavity, wherein the bottom surface of the ambient sensor forms a boundary of a second cavity and faces an unfilled void of the second cavity, and wherein a first integrated circuit die is enclosed in the embedding material;
- forming a lid membrane disposed over the ambient sensor, the lid membrane having an opening extending from the first cavity through the lid membrane;
- and
- forming plurality of conductive interconnect structures coupling the ambient sensor to the first integrated circuit die.
A method of operating an ambient sensor package comprising a package structure formed of an electrically insulating embedding material, the package structure comprising a cavity in the electrically insulating embedding material and a redistribution layer disposed on a first side of the package structure and supported by the package structure;
- an ambient sensor configured to detect a presence of a gas, the ambient sensor comprising a first integrated circuit die disposed over the cavity and having edges supported by the redistribution layer, the first integrated circuit die comprising a first side facing an unfilled void in the cavity, a second side opposite the first side exposed by an aperture in the redistribution layer, and a gas sensing region disposed on the second side of the first integrated circuit die, wherein the entire first side of the first integrated circuit die is substantially parallel to the entire second side of the first integrated circuit die;
- and a second integrated circuit die embedded in the package structure, wherein a thickness of the first integrated circuit die is less than a thickness of the second integrated circuit die, and the second integrated circuit die is electrically coupled to the first integrated circuit die via the redistribution layer, the method comprising:
- sensing a gas using the ambient sensor.
Dependencies are inferred from the claim text.