Apparatus for chemical mechanical polishing process

A processing system for performing a chemical mechanical polishing (CMP) process, the system comprising:

• a CMP tool configured to polish a semiconductor wafer;
• and
• an interface tool, comprising:
• a wafer stage configured to support the semiconductor wafer for facilitating the insertion of the semiconductor wafer into, and its subsequent removal from, the CMP tool;
• a plurality of spray nozzles positioned relative to the wafer stage;
• a spray generator connected to the spray nozzles and configured to convert a mixture to a mist spray;
• and
• a controller configured to activate flow of the mist spray from the spray generator to the spray nozzles to discharge the mist spray over the semiconductor wafer supported by the wafer stage in the interface tool.

A processing system for performing a chemical mechanical polishing (CMP) process, the system comprising:

• at least two CMP tools, configured to polish a semiconductor wafer, wherein the two CMP tools are arranged along an extension direction;
• and
• at least two interface tools, wherein the two interface tools are arranged along the extension direction, and each of the interface tools comprises:
• a wafer stage configured to support the semiconductor wafer for facilitating the insertion of the semiconductor wafer into, and its subsequent removal from, the CMP tool;
• a plurality of spray nozzles positioned relative to the wafer stage;
• a spray generator connected to the spray nozzles and configured to convert a mixture to a mist spray;
• and
• a controller configured to activate flow of the mist spray from the spray generator to the spray nozzles to discharge the mist spray over the semiconductor wafer supported by the wafer stage in the interface tool.