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US 2020/0051734 A1Published application
Coil module
AssigneeWITS Co., Ltd.
InventorsJae Sun WON, Hee Seung KIM, Soon Joung YIO, Dong Yeol LEE, Jae Hyuk JANG, Young Seung ROH
Life of this patent
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Abstract
A coil module includes an insulation layer; a wireless power transfer (WPT) coil disposed on a first surface of the insulation layer; and a heat dissipation pattern disposed around the WPT coil on the first surface of the insulation layer or disposed on a second surface of the insulation layer opposite the first surface, wherein a width the heat dissipation pattern is narrower than a width of the WPT coil.
Claims20
A coil module comprising:
- an insulation layer;
- a wireless power transfer (WPT) coil disposed on a first surface of the insulation layer;
- and
- a heat dissipation pattern disposed around the WPT coil on the first surface of the insulation layer or disposed on a second surface of the insulation layer opposite the first surface,
- wherein a width of the heat dissipation pattern is narrower than a width of the WPT coil.
2 more elements
A coil module comprising:
- an insulation layer;
- a near-field communication (NFC) coil disposed on at least one surface of the insulation layer;
- and
- a heat dissipation pattern disposed in an inner region of the NFC coil and disposed in an outer region of the NFC coil,
- wherein a width of the heat dissipation pattern is less than or equal to twenty-five (25) times a skin depth of a conductor of the NFC coil.
2 more elements
A coil module comprising:
- an insulation layer;
- a wireless power transfer (WPT) coil disposed one or both of a first surface of the insulation layer and a second surface of the insulation layer opposite the first surface;
- and
- a heat dissipation pattern disposed on one or both of the first surface of the insulation layer and the second surface of the insulation layer,
- wherein a width of the heat dissipation pattern is different than a width of the WPT coil.
2 more elements
Dependencies are inferred from the claim text.