Reclaimable semiconductor device package and associated systems and methods

A semiconductor device package, comprising a module of semiconductor dies, wherein individual semiconductor dies of the module are configured to:

• store module state information corresponding to whether the module is operable;
• receive a signal indicative of whether the module is to be reclaimed;
• and
• modify the signal based on the module state information.

A semiconductor device, comprising:

• a semiconductor substrate;
• and
• an arrangement of one or more circuit components at the substrate configured to:
• store a module configuration state configured to identify one or more inoperable modules in a device package that includes the semiconductor device;
• receive a signal indicative of a reclamation state indicating at least one module in the device package is inoperable;
• and
• enable at least a portion of the substrate for an operation based on the module configuration state and the reclamation state.

A semiconductor device assembly, comprising:

• a package having a housing, a first package contact arranged to receive a first signal indicative of a first reclamation state, and a second package contact arranged to receive a second signal indicative of a second reclamation state, wherein the first and second reclamation states each are configured to indicate at least one module in the package is inoperable;
• a support substrate having at least a first contact arranged to provide the first signal, and at least a second contact arranged to provide the second signal, wherein:
• the first package contact is electrically coupled to either the first contact or the second contact, and
• the second package contact is electrically coupled to either the first contact or the second contact;
• a first module of a first plurality of semiconductor dies within the housing and electrically coupled to the first and second package contacts, wherein individual semiconductor dies of the first plurality are configured to store a configuration state;
• a second module of a second plurality of semiconductor dies within the housing and electrically coupled to the first and second package contacts, wherein individual semiconductor dies of the second plurality are configured to store the configuration state;
• a third module of a third plurality of semiconductor dies within the housing and electrically coupled to the first and second package contacts, wherein individual semiconductor dies of the third plurality are configured to store the configuration state;
• and
• a fourth module of a fourth plurality of semiconductor dies within the housing and electrically coupled to the first and second package contacts, wherein individual semiconductor dies of the fourth plurality are configured to store the configuration state,
• wherein a combination of the first, second, third, and fourth modules is enabled for one or more operations based, at least in part, on the first signal, the second signal, and the configuration state indicative of which modules in the housing are inoperable.