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US 2020/0050816 A1Published application
Device mountable packaging of ultrasonic transducers
AssigneeInvenSense, Inc.
InventorJulius Ming-Lin TSAI
Life of this patent
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Abstract
An electronic device including an array of ultrasonic transducers for generating and receiving ultrasonic signals, and an acoustic coupling layer overlying the array of ultrasonic transducers, where the ultrasonic signals are propagated through the acoustic coupling layer.
Claims20
A mobile device comprising:
- a processor;
- a memory unit;
- a display device disposed on a first surface of the mobile device;
- and
- a fingerprint sensor disposed on a second surface of the mobile device, wherein the second surface is a curved surface having a curvature such that the fingerprint sensor is curved to match the curvature of the curved surface.
2 more elements
An electronic device comprising:
- an array of ultrasonic transducers for generating and receiving ultrasonic signals;
- an acoustic coupling layer overlying the array of ultrasonic transducers, wherein the ultrasonic signals are propagated through the acoustic coupling layer, the acoustic coupling layer comprising a material supporting transmission of the ultrasonic signals;
- a plurality of refractive acoustic elements for refractive beamforming of the ultrasonic signals;
- and
- a cover overlying the sidewalls and the acoustic coupling layer.
2 more elements
An electronic device comprising:
- an array of ultrasonic transducers for generating and receiving ultrasonic signals;
- an acoustic coupling layer overlying the array of ultrasonic transducers, wherein the ultrasonic signals are propagated through the acoustic coupling layer;
- and
- a cover overlying the acoustic coupling layer, wherein the cover is curved.
1 more element
Dependencies are inferred from the claim text.