Electronic device and click pad thereof

A click pad, applied to an electronic device, the electronic device comprising an upper case and a lower case, the click pad comprising:

• a top board, located under the upper case;
• a circuit board, located under the top board and connected to the top board;
• a metal elastic board, located under the circuit board, wherein the metal elastic board comprises:
• a metal elastic board main body, wherein a buffer gap is formed between the metal elastic board main body and the circuit board, and the buffer gap provides a buffer function to prevent a pressing force causing an excessive deformation;
• and
• at least one connection part, connected to the metal elastic board main body;
• at least one conductive connection layer, connected to the at least one connection part and the circuit board;
• a bottom bracket, located under the metal elastic board and located above the lower case, wherein the bottom bracket comprises at least one protruding part and the at least one protruding part supports the metal elastic board main body;
• and
• a restoration unit, supporting the circuit board.