Multistage micromechanical timepiece and method for making same
AssigneeCsem Centere Suisse D'Electronique Et De Microtechnique SA-Recherche Et DéVelopment [Ch/Ch]
InventorsMichel Despont, Philippe Niedermann
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AssigneeCsem Centere Suisse D'Electronique Et De Microtechnique SA-Recherche Et DéVelopment [Ch/Ch]
InventorsMichel Despont, Philippe Niedermann
Estimating the term…
The present invention relates to a micromechanical timepiece (1) having a plurality of mutually secured functional sub-assemblies (1a, 1b) stacked in a direction (Z) to form a multistage assembly, characterised in that each functional sub-assembly (1a, 1b) consists of a single semiconductor material and is secured to another sub-assembly (1a, 1b) via bridges (5) made of said semiconductor material, and in that at least one sub-assembly (1a, 1b) comprises at least two portions (2, 3), said portions being movable relative to each other and relative to another sub-assembly (1a, 1b) to which at least one of said portions (2, 3) is secured via at least one deformable link integrally formed between said portions (2, 3). The invention also relates to a method for making such a timepiece.
A micromechanical timepiece (1), including a plurality of functional subassemblies (1a, 1b) secured together and superimposed on each other along a direction (Z) for forming a multi-level assembly, characterized in that each functional subassembly (1a, 1b) is constituted of the same semiconductor material and is secured to another subassembly (1a, 1b) by bridges (5) constituted of said semiconductor material, and in that at least one subassembly (1a, 1b) includes at least two portions (2, 3), said portions being movable relative to each other and to another subassembly (1a, 1b) to which is secured at least one said portion (2, 3), by means of at least one deformable link integrally formed between said portions (2, 3).
The timepiece according to any of the preceding claims, characterized in that said subassemblies (1a, 1b) and bridges (5) or parts thereof are made of doped silicon.
The timepiece according to any of the preceding claims, characterized in that said subassemblies (1a, 1b) and bridges (5) or parts thereof are coated with a functionalization layer, in particular a thermo-compensation layer, a cushioning layer or a protective layer.
The timepiece according to any of the preceding claims, characterized in that it includes a cavity (7) arranged between said subassemblies (1a, 1b).
The timepiece according to any of the preceding claims, characterized in that said portions (2, 3) of one said subassembly (1a, 1b) are movable in rotation about a virtual axis of rotation or in translation in a plane perpendicular to the axis (Z).
The timepiece according to any of the preceding claims, characterized in that at least two said subassemblies (1a, 1b) directly superimposed along the direction (Z) form a trundle structure composed of members nested within each other with a play along the direction (Z)t, so as to limit and/or guide the movements of the movable portions of said subassemblies along directions parallel to the direction (Z).
The method according to claim 12, characterized in that steps e) and f) include the implementation of a reactive ion etching process.
The method according to claim 12 or 13, characterized in that it includes a surface flattening step after steps b) and/or d).
Dependencies are inferred from the claim text.