Image pickup module, fabrication method for image pickup module, and endoscope

A fabrication method for an image pickup module, the fabrication method comprising:

• fabricating a stacked element including a light receiving surface, a rear surface on a reverse side of the light receiving surface, a plurality of semiconductor elements including an image pickup device which are stacked and bonded to one another by a plurality of element bonding sections, and an external electrode disposed only in a second region out of a first region and the second region which are obtained by dividing the rear surface into two regions;
• connecting a first signal cable to a first electrode of a first wiring board having flexibility by a cable bonding section, the first wiring board including a first main surface, a second main surface on a reverse side of the first main surface, a front electrode disposed on the first main surface, and the first electrode that is electrically connected to the front electrode and disposed on the first main surface or the second main surface;
• connecting the external electrode of the stacked element and the front electrode of the first wiring board to each other by an interconnecting bonding section;
• and
• bending the first wiring board to establish a state in which the first wiring board is accommodated in a space defined by extending the first region in an optical axis direction, wherein
• a length of the first wiring board from the interconnecting bonding section on the first main surface to the cable bonding section is longer than a length of the stacked element from the interconnecting bonding section on the rear surface to an end side in the first region.

An endoscope comprising an image pickup module, the image pickup module including:

• a stacked element including a light receiving surface, a rear surface on a reverse side of the light receiving surface, a plurality of semiconductor elements including an image pickup device which are stacked and bonded to one another by a plurality of element bonding sections, and an external electrode disposed on the rear surface;
• a first wiring board including a first main surface, a second main surface on a reverse side of the first main surface, a front electrode that is connected to the external electrode of the stacked element by an interconnecting bonding section and disposed on the first main surface, and a first electrode that is electrically connected to the front electrode and disposed on the first main surface or the second main surface;
• and
• a first signal cable connected to the first electrode of the first wiring board by a cable bonding section, wherein
• the external electrode of the stacked element is disposed only in a second region out of a first region and the second region which are obtained by dividing the rear surface into two regions,
• the first wiring board is flexible and includes a bent section in a space defined by extending the first region in an optical axis direction, and
• a length of the first wiring board from the interconnecting bonding section on the first main surface to the cable bonding section is longer than a length of the stacked element from the interconnecting bonding section on the rear surface to an end side in the first region.