Silicon photonic solder reflowable assembly

A method for fabricating a silicon photonic (SiPh) solder reflowable assembly, comprising:

• forming a silicon interposer, comprising:
• an insulator on a given surface of a substrate;
• an active layer on another surface of the insulator that is opposite the substrate;
• and
• a grating on a given surface of he active layer that is opposite to the insulator;
• forming a lens array chip, the lens array chip comprising one or more lenses etched on a surface of a wafer,
• wherein the one or more lenses are adapted to expand, collimate, and tilt an optical signal beam exiting the grating,
• wherein the wafer is CTE matched to the silicon interposer;
• reflowing the lens array chip to the silicon interposer by a bonding agent at the wafer scale;
• aligning the one or more lenses with the grating to direct the optical signal entering the grating at a desired angle;
• forming an organic substrate on which to flip chip the silicon interposer;
• establishing an optical socket on the organic substrate in mechanical alignment with an optical connector of an optic fiber transmitting the optical signal.