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US 2020/0049806 A1Published application
Ultrasonic device and ultrasonic sensor
AssigneeSeiko Epson Corporation
InventorKoji OHASHI
Life of this patent
Estimating the term…
Abstract
An ultrasonic device includes a substrate having a first surface and a second surface having a front and back relationship with the first surface, and provided with an opening penetrating the second surface from the first surface; a vibration film provided over the first surface of the substrate so as to close the opening; a vibration element provided at a position overlapping the opening in the vibration film; and a sound absorbing portion provided over the second surface of the substrate.
Claims4
An ultrasonic device comprising:
- a substrate having a first surface and a second surface having a front and back relationship with the first surface, and provided with an opening penetrating the second surface from the first surface;
- a vibration film provided over the first surface of the substrate so as to close the opening;
- a vibration element provided at a position overlapping the opening in the vibration film;
- and
- a sound absorbing portion provided over the second surface of the substrate.
2 more elements
Dependencies are inferred from the claim text.