Contact and socket device for testing semiconductor

Abstract

Disclosed are a hybrid-type contact and a socket device for testing a semiconductor device, in which the hybrid-type contact includes a first contact unit integrally configured by rolling a predetermined shaped strip pattern formed by blanking a metal plate into a cylindrical shape, a second contact unit with conductivity and elasticity configured to be inserted into the first contact unit, and a molding portion of insulating elastic material configured to integrally fix the first contact unit and the second contact unit together, so as to compensate the disadvantages of conventional pin-type and rubber-type test socket devices, whereby it is easy to optimize the mechanical and electrical properties according to the requirements of the test device, and it is suitable for testing a fine pitch device.

Dependencies are inferred from the claim text.