Sensor device
AssigneeJtekt Corporation
InventorHiroto TSURUO
Life of this patent
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Abstract
A sensor device that can suppress deformation of a holder due to a molding pressure applied during injection molding of a housing is provided. A second magnetism collection portion holder has a suppression portion that projects from a second holder body portion toward a first holder and that suppresses deformation of the holder due to the molding pressure applied during the injection molding. The distal end surface of the suppression portion abuts against the inner surface of a first holder body portion with the first holder and a second holder assembled to each other with a sensor unit interposed therebetween.
Claims6
A sensor device comprising:
- a holder that surrounds a circuit member, to which an electronic component is electrically connected, and a sensor element electrically connected to the circuit member;
- and
- a housing formed by injection molding so as to cover the holder, wherein
- a suppression portion is provided inside the holder, the suppression portion extending in a column shape so as to connect between inner portions of the holder in a direction of deformation of the holder due to a molding pressure during the injection molding in order to suppress the deformation.
Dependencies are inferred from the claim text.