High-speed electroplating method

#All related applications are incorporated by reference

#The present application is based on, and claims priority from, Taiwan Application Serial Number 107127821, filed Aug. 9, 2018, the disclosure of which is hereby incorporated by reference herein in its entirety.

#The invention relates to an electroplating method. In particular, the invention pertains to a high-speed electrodeposition enhanced by ultrasonic oscillation.

#The invention will become more fully understood from the detailed description given herein below illustration only, and thus is not limitative of the present invention, and wherein:

#FIG. 1 is a scanning electron microscopy image showing the cross-sectional view of a copper pillar deposited via high-speed electroplating;

#FIG. 2 is a flowchart showing the steps for operating a high-speed electroplating method, according to the first embodiment of the present invention;

#The following embodiments of the present invention are herein described in detail with reference to the accompanying drawings. These drawings show specific examples of the embodiments of the present invention. It is to be understood that these embodiments are exemplary implementations and are not to be construed as limiting the scope of the present invention in any way. Further modifications to the disclosed embodiments, as well as other embodiments, are also included within the scope of the appended claims. These embodiments are provided so that this disclosure is thorough and complete, and fully conveys the inventive concept to those skilled in the art. Regarding the drawings, the relative proportions and ratios of elements in the drawings may be exaggerated or diminished in size for the sake of clarity and convenience. Such arbitrary proportions are only illustrative and not limiting in any way. The same reference numbers are used in the drawings and description to refer to the same or like parts.

#As used herein, the term “or” includes any and all combinations of one or more of the associated listed items.

#Please refer to FIG. 2 and FIGS. 3A to 3E, wherein FIG. 2 is a flowchart showing steps for operating a high-speed electroplating method according to the first embodiment of the present invention, and FIGS. 3A to 3E are schematic drawings of an embodiment of steps 110, 120, 140 and 150, 160, and 170 of the high-speed electroplating method of FIG. 2. In this embodiment, the high-speed electroplating method includes the following steps: providing a substrate containing a conductive layer on its surface (step 110); coating a dry-film photoresist on the conductive layer of the substrate, and patterning the dry-film photoresist (step 120); performing a pretreatment process to clean the substrate (step 130); disposing the substrate in an electroplating solution (step 140); turning on an ultrasonic oscillation machine to vibrate the electroplating solution, and performing a pre-electroplating process with a plating current density of 0.5 A/dm2 to 5 A/dm2, and then performing a high-speed electroplating process with a plating current density of 6 A/dm2 to 100 A/dm2 (step 150); depositing a conductive pillar on areas without the dry-film photoresist (step 160); and removing the dry-film photoresist being coated on the conductive layer of the substrate (step 170).