Electroless plating process
AssigneeKojima Chemicals Co., Ltd.
InventorsTomohito KATO, Hideto WATANABE
Life of this patent
Estimating the term…
Abstract
An object is to provide an electroless plating process which can thin a film thickness of a nickel film and can obtain a film having excellent mounting characteristics, when the nickel film and a gold film are sequentially formed on a surface of a copper material. In order to solve the above-mentioned problems, provided is an electroless plating process which sequentially forms a nickel film and a gold film on a surface of a copper material by an electroless plating method and includes: a step of forming the nickel film on the surface of the copper material by an electroless strike plating method; and a step of forming the gold film by a reduction-type electroless plating method.
Claims5
An electroless plating process for sequentially forming a nickel film and a gold film on a surface of a copper material by an electroless plating method, comprising:
- forming the nickel film on the surface of the copper material by an electroless strike plating method;
- and
- forming the gold film by a reduction-type electroless plating method.
Dependencies are inferred from the claim text.