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US 2020/0048763 A1Published application
Multilayer encapsulation thin-film
AssigneesResearch & Business Foundation Sungkyunkwan University, Samsung Display Co., Ltd.
InventorsChoelmin JANG, Sungmin CHO, Ho Kyoon CHUNG, Heeyeop CHAE, Sang Joon SEO, Seung Woo SEO
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Abstract
A multilayer encapsulation thin-film and a method and apparatus for preparing a multilayer encapsulation thin-film are provided. The multilayer encapsulation thin-film includes an inorganic thin film that includes a metal oxide, and an organic thin film that includes a polymer and is formed on the inorganic thin film, where the inorganic thin film and the organic thin film are alternately stacked in multiple layers
Claims5
An apparatus for producing a multilayer encapsulation thin-film comprising:
- a substrate loading unit on which a substrate is loaded;
- an inorganic thin film deposition unit to deposit an inorganic thin film on the substrate;
- and
- an organic thin film deposition unit to deposit an organic thin film on the inorganic thin film,
- wherein the inorganic thin film deposition unit and the organic thin film deposition unit are sequentially connected to each other, and the substrate loading unit is alternately moved to the inorganic thin film deposition unit and the organic thin film deposition unit, so that the inorganic thin film and the organic thin film are alternately deposited on the substrate.
2 more elements
Dependencies are inferred from the claim text.