Sputter trap having a thin high purity coating layer and method of making the same
AssigneeHoneywell International Inc.
InventorsJaeyeon Kim, Patrick Underwood, Susan D. Strothers, Shih-Yao Lin, Michael D. Payton, Scott R. Sayles
Life of this patent
Estimating the term…
Abstract
A sputtering chamber component including a front surface, a back surface opposite the front surface, and a sputter trap formed on at least a portion of the back surface, and a coating of metallic particles formed on the sputter trap. The coating has a thickness from about 0.025 mm to about 2.54 mm (0.001 inches to about 0.1 inches) and is substantially free of impurities, and the particles of the coating are substantially diffused.
Claims20
A sputtering chamber component comprising:
- a front surface;
- a back surface opposite the front surface;
- a sputter trap formed on at least a portion of the front surface, the sputter trap having a surface roughness greater than the back surface of the sputtering chamber component and a coating of metallic particles formed on the sputter trap, the coating having a thickness from about 0.025 mm to about 2.54 mm (0.001 inches to about 0.1 inches) and substantially free of impurities and the particles of the coating are substantially diffused.
A method of forming a sputter trap on a sputtering chamber component, the method comprising:
- cold spraying metallic particles on at least a portion of a textured surface of the sputtering chamber component to form a layer, the layer having a thickness from about 0.025 mm to about 2.54 mm (0.001 inches to about 0.1 inches).
Dependencies are inferred from the claim text.