Film Forming Apparatus and Film Forming Method

A film forming method of forming a predetermined film by a film forming apparatus,

• wherein the film forming apparatus comprises:
• a processing chamber having a processing space in which a film forming process is performed on a substrate;
• a substrate support part configured to support the substrate inside the processing chamber;
• at least one sputtering particle emission part including a target and configured to emit sputtering particles to the substrate from the target;
• and
• at least one etching particle emission part configured to emit etching particles having an etching action with respect to the substrate,
• the method comprising:
• supporting the substrate on the substrate support part;
• emitting the sputtering particles from the at least one sputtering particle emission part;
• and
• emitting the etching particles from the at least one etching particle emission part,
• wherein the sputtering particles emitted from the at least one sputtering particle emission part are deposited on the substrate to form a film, and
• wherein a portion of the film is etched by the etching particles emitted from the at least one etching particle emission part.