Thermally Conductive Polymer Composition for a Heat Sink
AssigneeTicona LLC
InventorYoung Shin Kim
Life of this patent
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Abstract
A polymer composition that contains a polyamide is provided. The composition exhibits a Charpy unnotched impact strength of about 5 kJ/m2 or more as measured at a temperature of 23° C. according to ISO Test No. 179-1:2010 and an in-plane thermal conductivity of about 15 W/m-K or more as determined in accordance with ASTM E 1461-13.
Claims11
1-23. (canceled)
A heat sink comprising a polymer composition, which comprises a polyamide and thermally conductive particulate material, wherein the polymer composition exhibits a Charpy unnotched impact strength of about 5 kJ/m2 or more as measured at a temperature of 23° C. according to ISO Test No. 179-1:2010 and an in-plane thermal conductivity of about 15 W/m-K or more as determined in accordance with ASTM E 1461-13.
A light assembly comprising a heat sink, the heat sink comprising a polymer composition that comprises a polyamide and thermally conductive particulate material, wherein the polymer composition exhibits a Charpy unnotched impact strength of about 5 kJ/m2 or more as measured at a temperature of 23° C. according to ISO Test No. 179-1:2010 and an in-plane thermal conductivity of about 15 W/m-K or more as determined in accordance with ASTM E 1461-13.
Dependencies are inferred from the claim text.