Polyisobutylene based passivation adhesive
Assignee3M Innovative Properties Company
InventorsYing Zhang, Vasav Sahni, Albert I. Everaerts
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Abstract
The present invention is an adhesive composition for use in passivating metallic conductors in an electronic device including at least one low molecular weight polyisobutylene polymer having a weight average molecular weight of about 75,000 or lower, at least one high molecular weight polyisobutylene polymer having a weight average molecular weight of about 120,000 or higher, and optionally, at least one tackifier. Each of the polyisobutylenes and the optional tackifier has a halogen ion content of no more than 1 ppm.
Claims21
An adhesive composition for use in passivating metallic conductors in an electronic device comprising:
- at least one low molecular weight polyisobutylene polymer having a weight average molecular weight of about 75,000 or lower;
- at least one high molecular weight polyisobutylene polymer having a weight average molecular weight of about 120,000 or higher;
- and
- optionally, at least one tackifier,
- wherein each of the polyisobutylenes and the optional tackifier has a halogen ion content of no more than 1 ppm.
An adhesive composition for use in passivating metallic conductors in an electronic device composition comprising:
- at least one low molecular weight polyisobutylene polymer having a weight average molecular weight of about 75,000 or lower;
- at least one high molecular weight polyisobutylene polymer having a weight average molecular weight of about 120,000 or higher;
- a passivating agent;
- and
- optionally, at least one tackifier.
(canceled)
Dependencies are inferred from the claim text.