Pattern forming method, under coating agent, and laminate
AssigneeOji Holdings Corporation
InventorsKazuyo MORITA, Kimiko HATTORI
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AssigneeOji Holdings Corporation
InventorsKazuyo MORITA, Kimiko HATTORI
Estimating the term…
It is an object of the present invention to provide a pattern forming method capable of easily forming a phase-separated structure with high accuracy, even in the case of widening the applicable range of a pattern size. The present invention relates to a pattern forming method comprising: applying an under coating agent onto a substrate, and applying a self-assembly composition for pattern formation to the surface of the substrate, onto which the under coating agent has been applied, and then forming a self-assembly film according to self-assembly phase separation, wherein the self-assembly composition for pattern formation comprises a block copolymer comprising a polymerization unit (a) having at least one selected from a structure represented by a formula (103) and a structure represented by a formula (104), and a polymerization unit (b) having a structure represented by a formula (105).
A pattern forming method comprising:
A under coating agent used for phase separation of a self-assembly composition for pattern formation, wherein
A laminate having a substrate, an under layer, and a pattern-forming layer in this order, wherein
A monomer for self-assembly composition for pattern formation, represented by the following formula (1′) or the following formula (2′):
A monomer for self-assembly composition for pattern formation, represented by the following formula (103′) or the following formula (104′):
Dependencies are inferred from the claim text.