Curable resin composition, cured product thereof, and semiconductor device

A curable resin composition comprising the following components (A), (B), and (C):

• (A):
• a polyorganosiloxane represented by the following average unit formula (I):
• (SiO4/2)a1(R1SiO3/2)a2(R12SiO2/2)a3(R13SiO1/2)a4 (I)
• wherein each R1 is the same or different and is an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 14 carbon atoms, an alkenyl group having 2 to 8 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, or a hydroxyl group,
• when a percentage of the alkyl group is X mol %, a percentage of the aryl group is Y mol %, and a percentage of the alkenyl group is Z mol % based on the total amount (100 mol %) of R1, X is 50 to 98 mol %, Y is 1 to 50 mol %, and Z is 1 to 35 mol %, and a1, a2, a3, and a4 are numbers satisfying a1>0, a2>0, a3≥0, a4>0, 0.5≤a1/a2≤10, and a1+a2+a3+a4=1;
• (B):
• a polyorganosiloxane represented by the following average composition formula (II):
• R2mHnSiO[(4−m−n)/2] (II)
• wherein each R2 is the same or different and is an alkyl group having 1 to 10 carbon atoms or an aryl group having 6 to 14 carbon atoms and at least one of R2 is an aryl group, at least 2 hydrogen atoms are bonded to the silicon atom, and m and n are numbers satisfying 0.7≤m≤2.1, 0.001≤n≤1, and 0.8≤m+n≤3;
• and
• (C):
• a hydrosilylation catalyst.