Gas barrier film and method for producing gas barrier film
AssigneeFUJIFILM Corporation
InventorEijiro IWASE
Life of this patent
Estimating the term…
Abstract
A gas barrier film has, in sequence, a support, an inorganic layer disposed on one surface side of the support, an adhesive layer disposed on a surface of the inorganic layer, and a resin layer disposed on a surface of the adhesive layer in which the adhesive layer has a thickness of 15 μm or less, and the adhesion strength between the inorganic layer and the adhesive layer is 21 N/25 mm or more and 60 N/25 mm or less. A method for producing a gas barrier film includes an inorganic layer deposition step and a bonding step in a vacuum.
Claims18
A gas barrier film comprising, in sequence:
- a support;
- an inorganic layer disposed on one surface side of the support;
- an adhesive layer disposed on a surface of the inorganic layer;
- and
- a resin layer disposed on a surface of the adhesive layer,
- wherein the adhesive layer has a thickness d1 of 15 μm or less, and
- an adhesion strength between the inorganic layer and the adhesive layer is 21 N/25 mm or more and 60 N/25 mm or less.
A method for producing a gas barrier film, comprising, in a vacuum:
- an inorganic layer deposition step of depositing an inorganic layer on one surface side of a support by plasma chemical vapor deposition (CVD);
- and
- immediately after the inorganic layer deposition step, a bonding step of bonding a laminate film having an adhesive layer and a resin layer onto the inorganic layer such that the adhesive layer and the inorganic layer face each other.
Dependencies are inferred from the claim text.